Optima is optimized for fast accurate and reliable bond testing in volume manufacturing environment.

4000Plus can shear up to 500kg, pull up to 100kg, push up to 50kg. Options with camera assist and automatic testing.

Famous bondtester in Semicon and PCB industries. Perform standard shear, pull and tweezer pull/peel.

4000HS can shear up 4m/s for shear, and 1.3m/s for pull, results can be shown in force or energy.

4300 offers similar advantages as 4000, and able to handle bump shear on 300mm wafer

This system provides automatic loading from cassette, bump testing and then unloading of 6" / 8" wafer.

Dage Bond Tester